| 
 Model
 | 
– HBFBU03-6412-B 
– HBFBU03I-6412-B 
– HBFBU03-6412-T (TPM) 
– HBFBU03I-6412-T (TPM) | 
| 
 CPU/Chipset 
 | 
– Intel® Elkhart Lake SoC Processor (J6412) | 
| 
 BIOS
 | 
– AMI Flash ROM | 
| 
 Memory
 | 
– 1* DDR4 3200MHz Dual Channel SO-DIMM up to 16GB | 
| 
 Network
 | 
– 2* Intel i255V 2.5GbE | 
| 
 Graphics
 | 
– Intel® HD Graphics, shared memory 
– 1* DP (Max Resolution: 4096×2160@60Hz) 
– 2* HDMI 2.0 (Max Resolution: 4096×2160@60Hz) 
– Support Triple Displays | 
| 
 Storage
 | 
– 1* M.2 M-key (2260/2280, PCIe Gen.3 x2/SATA interface) support NVME | 
| 
 Expansion slot
 | 
– 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface, used for WLAN device | 
| 
 Rear Panel I/O
 | 
– 2* RJ45 
– 1* DP 
– 1* DC-in 
– 2* HDMI 
– 1* USB3.1(Gen.2)  | 
| 
 Front Panel I/O
 | 
– 1* Power button + Power LED 
– 2* USB(TypeC) 
– 1* Audio(Line out+MIC) 
– 1* USB2.0 
– 1* USB3.1(Gen.2) | 
| 
 Internal Connector
 | 
– 32GB eMMC onboard | 
| 
 Power Source
 | 
– Adapter : AC 90~240V input / DC12V_40W output 
– MB : DC12V input | 
| 
 Compliance
 | 
– CE, FCC, LVD, RoHS, ErP Ready | 
| 
 Temperature
 | 
– Operating Temperature: -20 ~ 60° C 
(Under the condition of using M.2 interface SSD) 
– Operating Temperature: 0 ~ 50° C 
(Under the condition of using 2.5” SATA HDD) 
(The test environment is closed and windless) 
– Storage Temperature: -20 ~ 60° C 
– Humidity: 10% ~ 90% RH @40°C (non-condensing) | 
| 
 Dimensions
 | 
– System: 125 (W) x 109.2 (D) x 44.5 (H) mm | 
| 
 OS Support
 | 
– Windows 10, Windows 11, Linux |